Search Student Programs

Europe, Middle East and Africa

2022 Student Possibility Programme

This programme is designed to equip students from low socio-economic backgrounds for a Spring Internship

Eligibility

1) Those who are in their first year of a 3 year degree or second year of a 4 year degree
2) Students who identify with one of the below statements as defined by the UK government
3) Interested in the 2022 Spring Internship Programme

Program Type

Educational Programmes

City

London

Deadline

Applications for our 2022 Programme have now closed.

Overview

Gain real-life perspective on the industry while making invaluable connections

Goldman Sachs Student Possibility Programme is an interactive multi-day programme for candidates who identify as being from low socio-economic backgrounds* graduating in 2024. The programme is open to students from all degree backgrounds and is designed to introduce students to the financial world through hands on experience.

As a participant, you will:

  • Discover the extensive range of career opportunities in the financial services industry
  • Gain tangible resume-enhancing skills and tips through interactive workshops
  • Work closely with a group of peers to grow your technical and soft skills
  • Network with Goldman Sachs professionals and hear more about their experiences and diverse backgrounds


Location: London
Eligibility: Candidates who identify as first generation in their family to go to university, attend a state school (non-fee paying), or are eligible for free school meals
Application Details:

  1. Apply online via www.goldmansachs.com/careers
  2. Select up to 3 divisions under the 2022 EMEA Spring Internship
  3. Under the 'Affiliation / Upload Resume' section, specify ' Student Possibility Programme’ in the Job Code field

 


*Candidates who identify as first generation in their family to go to university, attend a state school (non-fee paying), or are eligible for free school meals

 

Divisions

Learn more about where you can apply for this program.